Intel Server System M50CYP2UR312 0GB (P4) telineasennettava palvelin
- Valmistajan koodi : M50CYP2UR312
- EAN : 5032037218993
2970,80 €
Leasing/vuokraus:102,65 €/kk ALV 0%, kun sopimusaika on 36 kk.
Tuotteen kuvaus
- Valmistajan koodi : M50CYP2UR312
- EAN : 5032037218993
- Tuotteen nimi : Intel Server System M50CYP2UR312 0GB (P4) telineasennettava palvelin
Puuttuu prosessori,muistit, levyt ja käyttöjärjestelmä
Tuotteen tekniset tiedot
Product Collection
Code Name
Launch Date
Q2'21
Marketing Status
Launched
Expected Discontinuance
2026
Limited 3-year Warranty
Yes
Extended Warranty Available for Purchase (Select Countries)
Yes
Additional Extended Warranty Details
Dual Processor Board Extended Warranty
Chassis Form Factor
2U Rack
Chassis Dimensions
712 x 439 x 89 mm
Board Form Factor
18.79” x 16.84”
Rack Rails Included
No
Compatible Product Series
3rd Generation Intel® Xeon® Scalable Processors
Socket
Socket-P4
TDP
270 W
Heat Sink Included
No
System Board
Intel® Server Board M50CYP2SBSTD
Board Chipset
Target Market
Mainstream
Rack-Friendly Board
Yes
Power Supply
2100 W
Power Supply Type
AC
# of Power Supply Included
0
Redundant Fans
Yes
Redundant Power Supported
Supported, requires additional power supply
Backplanes
Included
Included Items
(1) 2U 3.5” Chassis with -Quick Reference Label affixed to top cover - K52544
(1) Intel® Server Board M50CYP2SBSTD
(1) Front I/O assembly w/ two USB ports, left side –iPN K48177
(1) Front control panel (right) with control/status buttons -iPN K48178
(1) 2U Hot-swap backplane spare CYPHSBP2312
(12) HDD/SSD drive carriers 3.5" –iPN J36447
(16) DIMM Blank –iPN K91058
(1) Splitter power cable, server board connector to 3.5" HSBP power connectors, 425/660 mm -iPN K67596
(1) I2C cable, server board to- 250 mm -iPN K63231
(1) 2U Standard Air duct -iPN K52571
(6) 2U Spare Fan Kit CYPFAN2UKIT
(2) Processor carrier clip -iPN J98484
NOTE: NO PSU included
Supplemental Information
Description
Integrated 2U system featuring an Intel® Server Board M50CYP2SBSTD, supporting two 3rd Generation Intel® Xeon® Scalable processors, (12) 3.5" HDD with air cooling.
NOTE: NO PSU included
Memory & Storage
Memory Types
-DDR4 (RDIMM)
-3DS-RDIMM
-Load Reduced DDR4 (LRDIMM)
-3DS-LRDIMM
-Intel® Optane™ persistent memory 200 series
Max # of DIMMs
32
Max Memory Size (dependent on memory type)
12 TB
# of Front Drives Supported
12
Front Drive Form Factor
Hot Swap 3.5"
Intel® Optane™ Persistent Memory Supported
Yes
Processor Graphics
Integrated Graphics ‡
Yes
Expansion Options
Riser Slot 1: Total # of Lanes
32
Riser Slot 2: Total # of Lanes
32
Riser Slot 3: Total # of Lanes
16
I/O Specifications
Open Compute Port (OCP) Support
1 x 3.0
# of USB Ports
6
Total # of SATA Ports
10
USB Configuration
•Three USB 3.0 on the back panel
•One USB 3.0 + one USB 2.0
on the front panel
•One USB 2.0 internal Type-A
Max # of UPI Links
3
# of Serial Ports
2
Integrated SAS Ports
8
Package Specifications
Max CPU Configuration
2
Advanced Technologies
Advanced System Management key
Yes
Intel® Optane™ Memory Supported ‡
Yes
Intel® Remote Management Module Support
Yes
Integrated BMC with IPMI
IPMI 2.0 & Redfish
Intel® Node Manager
Yes
Intel® Advanced Management Technology
Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
TPM Version
2.0
Security & Reliability
Intel® Trusted Execution Technology ‡
Yes
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